Application Scope:
Material types: Brittle and sheet materials such as PCB boards, acrylic, PC boards, aluminum foil, double-sided/multi-layer boards
Processing scenarios: Drilling of electronic component boards, punching of packaging materials, precision punching of brittle and hard materials, etc.
Features of the Semi-Automatic Punching Machine:
1. Equipped with a CCD vision positioning system for precise positioning and improved processing accuracy
2. Supports vacuum adsorption function (e.g., VT015 model) for stable fixation of sheet materials
3. Has adjustable pneumatic pressure (0.4-0.6MPa) to meet processing needs of different materials (brittle materials/sheets)
4. Flexible processing parameters: drilling speed (e.g., 2000-12000r/min), stroke (e.g., 4.2mm), etc., adaptable to various scenarios
5. Compatible with multiple tool types (drill bits, glue needles, etc.), plus tool protection design to ensure operational safety
| Model |
VT015 |
| Max punching force | 2500N |
| Material width | 0-520mm(can be customised) |
| CCD positioning accuracy | ±0.02mm |
| Pneumatic pressure | 0.4~0.8Mpa |
| Outline size | 1250*700*(770+260)mm |
Hot Tags: Semi-Automatic Punching Machine CCD Vision Positioning Drill PCB Boar Drilling Machine Brittle Material Processing Vacuum Adsorption Punch Multi-Material Sheet Cutting Adjustable Pneumatic Punch
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